N-24

Citation: N-24. Jae-Bok Nam, “Development of New Auto Steels and Application Technology,” worldsteel / CISA China Automotive Steel Conference, Nov. 21, 2013

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C-30

Citation: C-30. P. Cugy, A. Hildenbrand, M. Bouzekri, D. Cornette, S. Göklü, and H. Hofmann, “A Super-High Strength Fe-Mn-C Austenitic Steel with Excellent Formability for Automobile Applications,” 2005; 

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D-30

Citation: D-30. B.C. De Cooman, O. Kwon, and K.-G. Chin, “State-of-the-knowledge on TWIP steel,” Materials Science and Technology, Volume 28, Number 5, 2012, pages 513-527, doi.org/10.1179/1743284711Y.0000000095.

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K-42

Citation: K-42. S.-K. Kim, G. Kim, and K.-G. Chin, “Development of High Manganese TWIP Steel with 980MPa Tensile Strength,” International Conference on New Developments in Advanced High-Strength Sheet Steels, 2008, Paper PR- 256-024, Page 249.

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D-29

Citation: D-29. B.C. De Cooman, Y. Estrin, and S.K. Kim, “Twinning-induced plasticity (TWIP) steels,” Acta Materialia, Volume 142, 1 January 2018, Pages 283-362, doi.org/10.1016/j.actamat.2017.06.046.

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E-11

Citation: E-11.   K. Enos, Innovations in coil metal processing, press feeding,” Stamping Journal, Volume 33, No. 1, January/February 2021, page 34. 

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C-29

Citation: C-29. D. Close, "Alternative protective coatings for hot stamped automotive body parts," Doctoral Thesis, Université de Lorraine, 2018. 

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H-57

Citation: H-57. C. Hoch-Baumann, "Opel Adam is pure lifestyle: The fresh small car attracts modern-day Eves," ThyssenKrupp compact, pp. 16-17, January, 2013.  

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S-90

Citation: S-90. T. Senuma, "Prospects for hot stamping productivity improvement technology and development of surface treatments and materials to realize it (in Japanese)", Presented at AP&T Future Forming Seminar, Yokohama, Japan, April 14, 2014, 2014. 

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L-46

Citation: L-46. Z. Ling, M. Wang and L. Kong, "Liquid Metal Embrittlement of Galvanized Steels During Industrial Processing: A Review", Transactions on Intelligent Welding Manufacturing, (pp.25-42), edited by S. Chen, Y. Zhang, and Z. Feng, 2018, Springer, Singapore,...

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